针对新能源汽车电机驱动器的高功率密度、高效散热和耐高温可靠性应用需求，开发了一种集成新型纳米铜低温烧结技术和3D分流散热技术的1200V-600A 大功率SiC半桥模块。

芯片、AMB基板和3D分流散热器采用纳米铜低温烧结封装策略，满足器件175~200℃高温可靠性和高效散热互联要求。

Aiming at the requirements of high power density, high conversion efficiency, High efficiency heat dissipation and high temperature reliability in EV/HEV motor drivers, a 1200V-600A high-power SiC half-bridge module, integrating advanced Nano-Copper-Sinter technology and 3D thermal shunt technology, is developed. SiC MOSFETS, AMB substrate and 3D thermal shunt heatsink are integrated together using nano-copper low-temperature sintering technology to meet the high-temperature reliability and heat dissipation interconnection requirements.

• 功率等级：1200V-600A
• 寄生电感：＜7 nH
• 工作结温：175~200℃
• 结壳热阻：0.04 K/W
• 互联集成：芯片-AMB基板-3D分流散热器全纳米铜低温烧结技术散热器
• 散热器：3D分流散热技术

• Power Level：1200V-600A
• Stray inductance：＜7 nH
• Operating temperature：175~200℃
• Thermal resistance：0.04 K/W
• Interconnection techniques：Nano-Copper-Sinter technology
• Heatsink：3D thermal shunt technology