采用多层银烧结工艺，陶瓷板增强散热，PCB优化回路寄生电感，并集成驱动、辅助供电、信号隔离以及散热器，适用于对功率密度要求极高的电机驱动应用场景，如燃料电池汽车高速空压机等。

The IPM is based on silver sintering processes, with enhanced thermal performance by ceramic substrate and optimized parasitic inductances. Gate driver, auxiliary power supply and heatsink are also integrated. It is suitable for motor driver application which requires high power density, such as air compressor in fuel-cell vehicles.

• 功率等级650V/10mΩ
• RDL及多层烧结工艺
• 隔离辅助供电及隔离驱动
• L_loop = 0.54nH，R_jc = 0.05 ℃/W ，R_ja (@0.5lpm) = 0.53 ℃/W

• Power level 650V/10mΩ
• Redistributed layers and multi-layer sintering
• Isolated auxiliary power supply and digital isolator
• L_loop = 0.54 nH, R_jc = 0.05 ℃/W, R_ja(@0.5lpm) = 0.53 ℃/W

课题最新成果：基于多层烧结工艺的功率器件3D集成封装的关键技术（2024年4月）